以600mm×600mm面板为例，其面积是12英寸晶圆载板的5.1倍，单片产出芯片数量大幅增加。同时，FOPLP的面积利用率超95%，显著优于传统晶圆级封装的85%，同等面积下面板可多容纳1.64倍芯片。基板面积增大持续降低成本，200mm向300mm过渡节约25%成本，300mm向板级封装过渡更可节约66%成本。
Following the president's Friday afternoon announcement, OpenAI CEO Sam Altman appeared on CNBC and voiced support for Anthropic. "For all the differences I have with Anthropic, I mostly trust them as a company and I think they really do care about safety, and I’ve been happy that they’ve been supporting our war fighters," Altman said, according to a clip of the appearance posted to X.
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